In 2026, that is finally changing. Co-Packaged Optics (CPO) — putting a silicon photonics engine directly inside the same package as a network switch or GPU ASIC — has moved from research papers and OFC demos into the shipping roadmaps of NVIDIA, Broadcom, Marvell, TSMC . In 2026, that is finally changing. According to LightCounting, sales of lasers and photonic integrated circuits for optical transceivers are expected to grow from $2. Read on to learn key CPO trends shaping AI systems in 2026 and the challenges designers will need to. 2026 will mark the year when co-packaged optics (CPO), a form of optoelectronic integration, enters the full-scale mass production and practical roll-out phase. As power consumption continues to surge with the rapid expansion of AI data centers, expectations are high that CPO will dramatically. Passage ® interconnects and Guide ® light engines scale networking for AI supercomputers. Complete photonics roadmap from NPO and OBO to 2D and 3D CPO and 3D Interposers. Edgeless I/O architecture enabling unlimited bandwidth scaling. Very Large Scale Photonics technology.
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